Alessandro Freguglia, ST Microelectronics

Transcript

"La collaborazione con i fornitori
nella Gestione Responsabile di Prodotto:
un esempio di sostituzione".
FEDERCHIMICA
06 Marzo 2013
STMicroelectronics
Alessandro Freguglia
MEMS Process Engineer
AGENDA
2
• ST Company Introduction
• Regulatory Context
• Substitution of Glass Frit  from Pb-based to Pb-free
• MEMS
• What are MEMS
• Glass Frit Processing
• Standardization
• Qualification
• Implementation
• Conclusions
STMicroelectronics - Alessandro Freguglia
Workshop - Gestione Responsabile del Prodotto - Un esempio di sostituzione
2013-03-06
Who we are
2013-03-06
About ST
4
•
•
•
•
•
•
•
A global semiconductor leader
The largest European semiconductor company
2011 revenues of $9.73B(1)
Approx. 50,000 employees worldwide(1)
12,000 people working in R&D
12 manufacturing sites
Listed on New York Stock Exchange, Euronext Paris
and Borsa Italiana, Milano
(1) Including ST-Ericsson, a 50:50 joint venture with Ericsson
2013-03-06
An Unwavering Commitment to R&D
5
7 main technology R&D centers
39 design centers – 20,000 patents
12,000 people in technology, design, product and system R&D
Technology R&D centers
Design Centers
Access this map: http://g.co/maps/kg63
2013-03-06
Flexible and Independent Manufacturing
6
France
(Crolles, Rousset, Tours)
Italy
(Agrate, Catania)
China
(Shenzhen, Longgang)
Morocco
Philippines
Malaysia
Singapore
Front-End
Back-End
2013-03-06
Our Vision
7
2013-03-06
2012 Product Segments
8
50/50 JV with Ericsson
Wireless
Digital
Digital
Convergence
Group
(DCG)
Imaging, BiCMOS ASIC
& Silicon Photonics
Group
(IBP)
Automotive
Automotive
Products
Group
(APG)
Analog &
Microcontrollers
Analog,
MEMS &
Sensors
(AMS)
Micro,
Memory &
Security
(MMS)
Power
Discrete
Industrial &
Power
Discrete
(IPD)
2013-03-06
8
2012 Revenues by Product Segments
9
Wireless
Automotive (APG)
16%
Digital
16%
12%
Power Discrete (PDP)
18%
38%
Analog, MEMS &
Microcontrollers
(AMM)
2013-03-06
Regulatory Context
10
Applicable Regulations
• RoHS – Restriction of Hazardous Substances in Electric and
Electronic Equipment (EU Directive 65/2011)
• RoHS – Lead (Pb) maximum concentration value 1000 ppm at homogenous
material
• Allowed exemption for the use of Lead (Pb) in Electrical and Electronic components
containing Lead (Pb) in a glass or ceramic, or in a glass or ceramic matrix compound
• Expiring July 2016
• REACH – Registration Evaluation and Restriction of Chemicals
(EU Regulation 1907/2006)
• REACH – Restriction of use of certain Substances of Very High Concern
• Several Pb based substances included in the SVHC candidate lists
• Lead Oxide restricted at a concentration of 1000 ppm
2013-03-06
Substitution of Glass Frit
From Pb-based to Pb-free
• Working together with our different Suppliers, we have performed the
substitution of Pb-based Glass Frit with Pb-free Glass Frit
ST with Suppliers
GLASS
FRIT
Pb
Pb-free
CRITERIA

PROCESS

PRODUCT

QUALIFICATION
2013-03-06
11
12
Step back
MEMS
2013-03-06
MEMS
What are MEMS?
• MEMS means Micro Electro Mechanical Systems
… taking advantage of the mechanical AND electrical properties of silicon
• Three key elements:
• Micron-sized Transducer realized through a specific process called Micro-Machining
(THELMA)
• An Extreme Analog Chip with embedded smart functionalities
• Dedicated package and calibration features
2013-03-06
13
MEMS
Typical MEMS Applications
• Aerospace  Gyroscopes, accelerometers,…
• Automotive  Airbags,…
• Biomedical  Lab On Chip,…
• Chemical  Sensors,…
• Consumer products  Smartphones,…
• Fluidics  Micro-pumps,…
• Gaming  Consoles, controllers,…
• Optical displays  Micro-mirrors,…
• Wireless and optical communications  RF antennae,…
2013-03-06
14
• Make Sensor wf
MEMS
How we make them
• Where actual Sensor device is built
• Tech highlights
• Thick Epitaxial Polysilicon Layer
• High A.R. Dry silicon Etch
• TSV or std
• Make Cap wf
• Role: protect Sensor device from
environment
• Glass Frit application via Screen
Printing
• Bond Sensor wafer with Cap wafer
• Bonding Tech.: Glass Frit, Metal
Bonding, Dry Resist
• Dice & Assemble in package with
electronics driver chip (ASIC)
2013-03-06
15
SENSOR
MEMS
Glass Frit
• Glass Frit is used to hermetically seal
devices
• Glass Frit PASTE
• Glass powder (frits) | Organic Binder |
Filler | Solvents
• Why Pb-based
• for Low Temperature compatible with
Aluminium pads
• Glass Frit Wafer-to-Wafer Bonding is
one of most used techniques
• Screen printing | CTE | Different
substrates | Rough surfaces | Stability
after bonding
2013-03-06
16
MEMS
Glass Frit Processing
• Screen Printing
• Glass Frit Paste
• Pattern transfer
• Firing
• Thermal treatment in batch
oven
• Transform Glass Frit Paste
(Binder + solvent + Glass powder)
 Glass
Temperature
Firing
Binder burnout
Drying
Time
• Bonding
• Thermal Treatment on Bonder
Equipment
• “Soften” Glass  squeeze wfs
together
• Promote Adhesion between wfs
Temperature↑,
Force↑
2013-03-06
17
MEMS
Glass Frit Substitution - Desirable
• To change from STANDARD, WORKING, HIGH YIELD Pb-based
Glass Frit to NEW Pb-free Glass Frit what was necessary?
CRITERIA

•
•
•
•
•
PROCESS
Same Equipment
Standardize
Industrialize
Throughput
Wafer Cost

•
•
•
•
PRODUCT
No Redesign
High Yield
History
Client
Qualification

QUALIFICATION
•
•
•
•
Standard testing
History
Reliability
Repeatability
2013-03-06
18
MEMS
Glass Frit Processing
Standardization, Qualification & Implementation
• Change from STANDARD Pb-based GF to Pb-free GF,
but with same processes, and same qualification criteria
PROCESS
GF Pb-based
GF Pb-free
Qualification
criteria
Desired Outcome
Screen
Printing
Reference
Same
Line definition
No difference
Firing
Reference
Same
Thickness,
width,
defectiveness
(cracks, holes)
No difference
Bonding
Reference
Same
Bond Line
Scanning
Acoustic
Microscopy
Electrical
Testing
No difference
2013-03-06
19
Conclusions
20
Glass Frit is used on ST success MEMS products
• Substitution of Glass Frit: Pb-based  Pb-free
• Low Temperature Pb-free Glass Frit
• Criteria
• No Process change (3 processes)
• PRINTING | FIRING (TEMPERATURE) | BONDING (TEMPERATURE)
• Same Products
• Same Qualification Standards
• Involve Suppliers
• Growth (Product Portfolio)
• New Market opportunities
• ST
• Suppliers
2013-03-06
Thank You
21
2013-03-06
Contact INFO
22
Alessandro Freguglia
Front-End Manufacturing
Region Italy Manufacturing Operations
Agrate AGM GF-W/W Bonding Process Eng.
STMicroelectronics S.r.l.
via C. Olivetti,2 - 20864 Agrate Brianza - Italy
T|+39.039.603.7839
M|+39.346.0117614
F|+39.039.603.6220
E|[email protected]
2013-03-06
Empty
23
2013-03-06
MEMS
Glass Frit Process Qualification Criteria
• Screen Printing
• Line definition
• No defects
• Wettability
• “Printability”
• Firing
• Thickness &
Width
• Material
• W2W Bonding
Temperature↑,
Force↑
• Bond strength
(Adhesion)
• Bond Line
• No segregation Pb
• Electrical Testing
• In spec
• No defects
(cracks/voids/
segregation)
• GF to both
substrates
• SAM
• Segregation
promoted by
thermal treatment
2013-03-06
24

Alessandro Freguglia, ST Microelectronics

Transcript

Documenti analoghi

Seminar Invitation

settore tecnico f - FIGC Settore Tecnico Coverciano

modulo di adesione - medi

HELENE BINET / londra

The glass mosaics tesserae of "Villa del Casale" (Piazza Armerina

Il programma della rassegna

GLASS IN VENICE GLASS IN VENICE PRIZE

1 - Consolato Generale del Giappone a Milano

brochure tesserae - Valmori Ceramica Design

GORIZIA presentazione workshop e concerto ITA