Computer-On-Modules Summer 2010

Computer - On - Modules
Summer 2010
About congatec
About congatec AG
Module Know How
BIOS Expertise
Lifecycle Support
congatec AG is an experienced company
serving the quickly growing embedded computer
technology market. Our product portfolio is
comprised of embedded computer boards
& modules with BIOS features for industrial use,
professional board support packages and
extensive design-in support. Embedded computers
are our passion. It’s our goal to establish long-term
partnerships with our customers so that we can
meet your ever-demanding needs.
The congatec engineering team is committed
to the embedded module technology from the
very beginning of this industry. This vast amount
of knowledge and experience translates directly
into superior hardware, software and support for
our customers.
When it comes to Embedded computing often
the difference between one company’s product
and another’s is the BIOS. congatec has many
years of experience in BIOS development.
The congatec Embedded BIOS expands the
functionality of a standard BIOS allowing for
our products to be implemented into many
industrial uses.
Today it is obvious that product attention not
only starts with the first prototypes but also must
be maintained throughout series production. In
addition to this congatec is offering life cycle
support during our product’s lifetime. This means
we will offer replacement modules, when
applicable, and quick and efficient handling
of repairs during the life cycle of our products.
congatec will also pay close attention to
component life cycles in order to provide our
customers with advanced end-of-life warnings for
our products.
Economical Principal
Our products and technologies offer innovative
solutions for industrial uses of embedded computer
technology. We strive to make high-tech world
standards economically viable. Although we offer
full functionality, the customer has the ability to
utilize only those functions that are nec-essary for
their application.
Quality
congatec AG is certified in compliance with
ISO9001. All congatec products are made to meet
the highest quality standards. All our manufacturers
are also ISO9001 certified.
EN ISO 9001: 2000
2
Software and Driver Support
congatec offers advanced Board-SupportPackages, which include both the latest tested
drivers from silicon vendors and the congatec
specific drivers for accessing all of our additional
embedded module features.
Display Technology
Due to the fact that flat panel manufacturers
don’t follow a uniform specification, special
adaptation know how is necessary. Automatic
Panel Detection via EPI (Embedded Panel
Interface based on VESA EDID™ 1.3) can detect
and configure most flat panels available on the
market today.
EN ISO 9001: 2000
Design-In Support
congatec realizes how important it is in an
embedded module system that both the
customer’s carrier board and the embedded PC
work together perfectly. The congatec team is
committed to giving the best design-in support to
our customers.
System Integration
When designing a system special attention must
be paid to issues such as heat dissipation and
electrostatic/electromagnetic compatibility. By
using our products you gain access to congatec
experience, which will help you deal with these
issues.
Focussing on core competencies
Embedded computers are congatec’s passion.
We exclusively develop embedded computer
modules. With this focus, and thanks to the many
years experience of our employees, we have
achieved a very high degree of specialization.
This knowledge is there for you to make use of
and to strengthen your application know-how in
your industry.
congatec
congatec AG International
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Technology
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Qseven
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 Strategic Partner
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COM Express
 Sales Partner
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Tools
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Find more details at: www.congatec.com/partner.html
3
XTX / ETX
 congatec
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Computer - On - Modules - the concept
Embedded computer modules are highly integrated single board computers
particularly suited for implementing customized solutions. Embedded computer
modules are used when standard single board computers are not suitable for
mechanical reasons or due to a lack of expandability.
The difference between boards
and modules
Embedded computer modules are very small
computer boards that can be integrated in
almost every application without a cable
connection. Every signal is transmitted via
small, densely packed board-to-board industrial
connectors to a customer- or application-specific
carrier board. This carrier board contains all the
hardware expansions and also allows the cable
less distribution of the required interfaces.
Computer boards are equipped with numerous
and various connectors in order to allow
the connection of a variety of peripherals
and expansions. Complex solutions based
on computer boards require many cable
connections, which is frequently a cause of
problems during tough industrial use.
Customer specific solution
The carrier board contains all the special
functionalities required by the corresponding
embedded application. This could be special
interfaces, a unique power supply, as well as the
mechanical design and the slot placement. The
embedded computer module itself is plugged in
like a component. This ”component” represents a
complete computer that is the intelligence of the
application.
4
Cooling
The heatspreader serves as a thermal interface
between the embedded computer module and
the cooling solution of the system. Thus, e. g. the
excess heat can be passed directly to the system
housing. The heatspreader is defined in the COM
specification and is uniformly implemented for all
modules.
Flexible and robust
mechanical solutions
In comparison to most computer boards,
modules are very small and allow for very
compact solutions.Because the modules are firmly
screwed down, solutions are possible even for the
most difficult environmental conditions.
Economical
By avoiding expensive and sensitive cable
connections, solutions based on embedded
computer modules are already economical in
mid-sized quantities.
Scalability
congatec currently offers modules from 500 MHz
to 2.66 GHz. However, not only is the computer
performance scalable, but also the interface
configuration. You get precisely the performance
your application needs.
Long-term availability
The excellent long-term availability of all
congatec modules is further extended as a result
of the clearly defined module interface enabling
broad market offers.
Minimized development risk
The complexity of carrier board development is
significantly reduced when embedded computer
modules are used. With lower complexity, the
probability of error is naturally lower as well. This
means the cost and time frame of the project
can be met with a significantly lower risk.
Time-to-market
With a module-based solution, a complex
CPUboard design with accompanying BIOS
development is not necessary. Modular solutions
are therefore ready for market significantly faster.
To accelerate the time-to-market even further,
congatec offers starter kits. With this, hardware
and software development can get under way
immediately. Appropriate board-support packages for all standard operating systems provide
an additional head start.
congatec
- Lower engineering cost
- Lower design risk
COMs puts you in a leading position.
The use of customized carrier boards
reduces necessary engineering effort
by separating your design work from the
embedded PC technology. Use COMs in
your design and you can stay focused
on your own core competency.
- Lower product cost
- Lower transition risk
- Scalability
- Faster time to market
- Performance upgrades are easy
- Faster engineering
- Technology upgrades are easy
- Faster reaction time to market changes
- Lower cost of life cycle management
COM Standard
ETX Rev. 2. x
Qseven
XTX
COM Express
Size
95x114mm²
70x70mm²
95x114mm²
Bus
PCI, ISA, I²C
PCI Express 4 Lanes, LPC, I²C
PCI Express 4 Lanes, PCI, LPC, I²C
-/-
2x / -
4x / -
Basic 95x125mm²
Extended 110x155mm²
PCI Express max. 22 Lanes, PCI, LPC,
I²C
4x / -
4x / 1x 100 MBit
8x / 1x 1 GBit
6x / 1x 100 MBit
8x / 1x 1 GBit
Analog
Digital (HDA)
Analog / Digital (AC'97 / HDA)
Digital (AC'97 / HDA)
Graphic
On Board/PCI/ISA
On Board/PCI Express (max. 4)/SDVO
On Board/PCI Express (max. 4)
On Board/PEG/2xSDVO
Display Interface
VGA / TVout / LVDS
LVDS / SDVO / DisplayPort / HDMI
VGA / TVout / LVDS
VGA / TVout / LVDS / SDVO
~0.6 GByte/s
~2.9 GByte/s
~3.3 GByte/s
up to ~12.4 Gbyte/s
-
yes
-
-
www.etx-ig.com
www.qseven-standard.org
www.xtx-standard.org
www.picmg.org
SATA/SDIO
USB/Ethernet
Audio
I/O Bandwith over all (no Panel
Signals)
Software Interface (API)
Homepage
5
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Technology
Time-to-market advantage
COMs are flexible and can meet all
performance requirements. The modules
support a wide range of performance up
to the Intel Core i7 processor, as well as
future architectures. The COM standards
are well established and are already
prepared for the future.
Qseven
Improved flexibility
COMs minimize risk. Basic changes
during the design phase, or in the middle
of a product's life cycle, are easily
managed. Simply plug in the nextgeneration COM module and continue.
COMs allow for easy upgrades.
COM Express
Reduced risk
COMs save money. The cost of the
development and end product are
dramatically reduced. This holds true
for the product's entire life cycle. ETX
provides a cost advantage from the
beginning.
XTX / ETX
Lower costs
Tools
Advantages when compared to a full custom design
ACPI Battery Management
In combination with an ACPI operating system, the battery functionality associated with mobile
platforms is supported by congatec embedded computers. Now it‘s much easier to build mobile
embedded applications that have notebook battery functionality.
ACPI Battery Management
The congatec ACPI BIOS and board controller are designed to support a
CMB (Control Method Battery) sub-system.
The board controller interacts with the battery solution by providing the
congatec ACPI BIOS with all the required battery information.
Since all congatec designs are equipped with the board controller, the
entire Qseven™, XTX and COM Express® product family range supports
ACPI Battery Management.
By following our CMB interface specification, customers can implement
their own battery solutions or obtain a fully tested battery system from
congatec AG.
Power Button
MicroController
I²C / SMB
I²C, BAT_LOW#, PS_ON, PWR_BTN, S5
12V
Converter
SMART
Battery
#1
..
Charger
Switch
SMART Li-ion
CC/CV-Charger
SMART
Battery
#2
..
Power MUX
5V
Standby
Converter
5V
Converter
SBM²
DC Input
=
~
AC/DC
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6
conga - SBM²
Ready to use Smart Battery Manager Module
110V AC
230V AC
Application
OS
ACPI CGOS
CMB
congatec
Board
Controller
Computer-On-Module
Carrier Board
congatec
congatec Embedded BIOS
congatec have taken these requirements into account when designing our BIOS functionality. By drawing on the
wealth of information that has been gathered as a result of many man-power years of combined experience in
BIOS development, we have implemented the special requirements of an embedded BIOS into the congatec BIOS.
Hardware Monitoring
The congatec embedded BIOS allows the
customer to store their own defaults in flash
memory. This helps reduce the need for
customized BIOS versions.
The congatec BIOS already has the routines to
monitor critical components implemented. Fans,
operating voltages and several temperature
sensors can be monitored without incurring
additional development costs.
Multi Stage Watchdog Timer
All congatec modules are equipped with a
multi stage watchdog timer supporting different
events such as NMI, hardware reset or power
button. It can either assert a single event and/
or any combination of these events. Triggering
can happen by software and/or external OEM
hardware.
congatec Board Controller
An onboard µc fully isolates some of the
embedded features such as system monitoring
or the I²C bus from the x86 core architecture,
which results in higher embedded feature
performance and more reliability.
Manufacturing Data Storage
The congatec board controller provides a
rich data set of manufacturing and board
information: Serial Number, Article Number,
EAN Code, Manufacturing and Repair Date,
System Statistics and more. The BIOS also keeps
track of dynamically changing running time and
boot count data. All this data is accessible by a
uniform API.
Flexible BIOS Expansion
User Data Storage Area
The congatec embedded BIOS Features are
accessible through a uniform 32 Bit API.
congatec modules provide 32 Bytes of non
volatile storage in the EEPROM and a 64 kByte
block in the BIOS flash memory.
Fast Mode I²C Bus
Customer Logo
The I²C Bus is a low speed bus interface often
used for sensors, converters or data storage in
embedded applications. All congatec modules
offer a 400 kHz multi-master I²C Bus that provides
maximum I²C bandwidth.
The BIOS can display a custom logo instead of
the traditional diagnostic output during POST. With
the congatec embedded BIOS customers can
now integrate an OEM logo into the standard
BIOS by themselves.
Customer specific code can be executed while
booting the system. During power on self test
(POST) the congatec BIOS can give control to
customer specific code. This gives customers
more flexibility to initialize special hardware
extensions.
congatec System Utility
Watchdog Events
NMI
Reset
Power
Button
ACPI
Event
NMI
Routine
Hardware
Reset
Switch
ON/Off
Shutdown
or Reset
No Trigger
32 Bit Uniform OS API
congatec System Utility
All Embedded BIOS features are accessible
through the use of a congatec Windows tool.
This includes all manufacturing and statistical
information; e.g. serial number, running hours,
boot counter etc. BIOS default settings, bootlogo
and flat panel configurations can easily be
programmed using this flexible and powerful tool.
ACPI
Event
No Trigger
Hardware
Reset
Multi Stage
Multi Stage Watchdog Timer
COM Express
Customer specific CMOS Defaults
Power Management and System Configuration
is supported by the congatec BIOS according to
the ACPI specification.
Board Support Packages
congatec offers advanced BSPs, which include
both the latest tested drivers from silicon vendors
and the congatec specific drivers for accessing
all of our additional embedded BIOS and
module features.
XTX / ETX
ACPI Support
Qseven
Technology
Embedded computer users usually require more than the standard functionality of an office computer. We at
BIOS Setup Data Backup
Tools
The BIOS CMOS settings are held in flash memory
to allow battery-less applications.
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Qseven™ - the mobile COM definition
Targeting next generation ultra mobile embedded processors built using 45 nm technology,
the Qseven™ format complements the low power and small size of these processors. By
exploiting the small form factor of the industry`s latest processors, the Qseven™ format offers
high performance computing power, delivered in a module measuring only 70 x 70 mm.
Qseven™ Interface
PCi EXPRESS®
ExpressCard™
™
LPC
SDVO
Qseven feature set
8
max.
4x x1 Lanes
USB 2.0
8
Express Card™
2
SATA
2
LPC
1
SDIO
1
HDA (High Definition Audio)
1
SDVO
1
Display Port
1
HDMI™
1
Gigabit Ethernet
1
CAN™
1
congatec
Technology
Qseven
Connector
Graphics Interfaces
PCI Express
Qseven™ is unlike previous Computer-OnModules (COM) standards due to its primary focus
being directed towards mobile and ultra mobile
applications. It defines fast serial differential
interfaces such as PCI Express and Serial ATA but
omits support for legacy interfaces like EIDE and
PCI in order to provide ideal support for today as
well as future CPU's and chipsets.
Unlike most previous module standards, Qseven™
does not require an expensive board-to-board
connector. Instead, it utilizes a very affordable
MXM card slot with 230 pins in a 0.5 mm
configuration. This slot is already being used
for graphics cards in laptop computers, so it
is capable of the high speed PEG (PCI Express
Graphics) data transfers.
The video interfaces have been designed with
increased flexibility. A total of four different output
possibilities are defined. Direct control of a flat
panel display via 2x24 Bit LVDS (Low Voltage
Differential Signal) with DisplayID and EPI panel
detection. The physical signals the SDVO port are
shared with DisplayPort and TDMS.
Qseven™ offers up to 4 PCI Express™ x1
lanes. This allows the customer to equip their
embedded PC application with the next
generation of PC performance.
Low Power
Legacy free
Qseven™ is defined for a maximum power
consumption of 12 Watt operated by a single 5
Volt DC power and provides all additional signals
for battery management. This simple power
requirements allow for small mobile solutions
powered by compact two cell batteries.
Qseven™ is a legacy free standard and only
focused on high speed serial interfaces.
When utilizing the SDIO interfaces, rugged and
cheap SD-Cards can be used as bulk memory.
Qseven™ defines an 8 Bit SDIO interface that is
capable of a maximum data transfer rate of 52
MByte/s. The Secure Digital standard also enables
other applications such as WLAN, Bluetooth, RFID
etc. while using the same card format.
Compact Size
Qseven™ embedded computer modules are
equipped with a common software API for
industrial applications such as Watchdog Timer,
I²C Bus, LCD brightness control, BIOS user storage
area and the reading of system temperatures.
Qseven™ modules from different manufacturers
can thus be easily exchanged without
modifications to hardware or software.
XTX / ETX
Software API
Tools
The module's dimensions are 70x70mm² only.
This means it can be easily integrated into size
constricted systems.
SDIO
COM Express
Mobile Applications
9
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Ultra Mobil - Qseven™
Ultra compact Qseven™ module based on Intel® Atom™ Processor Z5xx
conga-QA
Module for ultra mobile
applications
Formfactor
Qseven Form Factor, 70x70 mm
CPU
Intel® Atom™ processor Z530 1.6 GHz, 533 MHz FSB and memory bus speed, 512k L2 cache, 45 nm,
with Hyper-Threading Technology
Lowest power consumption
Fast serial differential interfaces
for high data bandwidth
10
Intel® Atom™ processor Z510 1.1 GHz, 400 MHz FSB and memory bus speed, 512k L2 cache, 45 nm
DRAM
Up to 1 GByte on-board DDR2 memory with 400/533 MT/s
Chipset
Intel® SCH US15W
Ethernet
Gigabit Ethernet Realtek RTL8111
I/O Interfaces
8x USB 2.0, 1x SATA, 1x SDIO, 1x PCIe, I²C Bus, 1x USB client, LPC bus
Mass Storage
On-board ATA Solid State Drive up to 4 GByte (optional)
Sound
Intel® High Definition Audio (Intel® HD Audio)
Graphics
Intel® Graphics Media Accelerator 500 (Intel® GMA 500), up to 256 MByte frame buffer supporting
Direct X 9.0E and Open GL 2.0
Video Decode Acceleration
Full hardware acceleration for MPEG2, H.264, WMV9 and VC1
Motion Video Support
Single channel 112MHz LVDS transmitter, support for flat panels with 1x18 and
1x24 bit data mapping up to resolutions of 1366x768 pixel
Single channel SDVO interface, supports resolutions up to 1280x1024 pixel
Dual independent display support
congatec Board Controller
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board information, Board
Statistics,
I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control
Embedded BIOS Features
OEM Logo, OEM CMOS Defaults, LCD Control, Display Auto Detection, Backlight Control, Flash Update, based on AMIBIOS8®
Power Management
ACPI 3.0 compliant, Smart Battery Management
Operating Systems
Windows® XP, Windows® XP embedded, Windows® CE 6.0, LINUX, QNX
Power Consumption
Typ. application ~5 Watt @ 5V
Temperature
Operating: 0 to +60°C
Storage: -20 to +80°C
Humidity
Operating: 10 to 90% r. H. non cond.
Storage: 5 to 95% r. H. non cond.
Size
70 x 70 mm (2¾" x 2¾")
congatec
Qseven™ mini carrier board
This complete kit provides the ability to start evaluating Qseven™
Full Feature Set. The conga-Qcarrier is a full featured,
modules immediately. Contents:
miniaturized carrier board for Qseven™.
conga-QEVAL evaluation carrier board
Small size: 95x140 mm
conga-LDVI LVDS to DVI converter
Qseven™ module socket
conga-FPA2 evaluation flat panel adapter
SDIO socket
SATA-to-CF card adapter
Mini PCI Express socket
SATA-to-IDE converter
LVDS
ATX power supply
DVI output through HDMI connector
Complete cable set
6x USB
congatec USB memory stick
Ethernet
Product documentation and BSPs are available at:
www.congatec.com
2 SATA & SATA power
XTX / ETX
conga-QKIT
COM Express
Qseven
Technology
Qseven™ - Engineering Tools
Tools
19V DC power input with battery management signals
11
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Qseven™ - Engineering Tools
Qseven™ Mobility Kit
The congatec Qseven™ mobility kit provides the ability to
USB Touch
BKLT
start evaluating Qseven™ modules for all kind of mobile
LED Backlight
Module
applications immediately. Contents:
USB
SATA
SATA
LAN
LVDS
Qseven™ mini carrier board 95x140mm
2x USB
19V DC power supply
Mini Smart Battery Module for Qseven
I²C / SMB
MicroController
Charger
Switch
SMART Li-ion
CC/CV-Charger
Power MUX
HDMI-to-DVI adapter
conga-SBM Q battery manager
2
Smart battery
12
I²C, BAT_LOW#, PS_ON, PWR_BTN, S5
5V 20W
Converter
conga-SBM²Q
Litium-Ionen
Accu Pack
3 Cell
HDMI
DVI
5V 2W
Standby
Converter
Power
5,7" TFT LVDS display with installed touch panel
and LED backlight
Feature
Flat panel LVDS adapter with USB touch controller
and LED backlight control
Litium-Ionen
Accu Pack
3 Cell
PWRBTN
LED
Audio
14 V DC
Power Supply
USB
USB
USB
USBc
conga-QEVAL
conga-SBM 2Q
Evaluation Board for Qseven™ modules.
conga-SBM2Q is a complete battery manager sub-system
To achieve a quick start with Qseven congatec offers an evaluation carrier
in the form of a plug-in module.
congatec
COM Express
Qseven
Technology
Qseven™ - Engineering Tools
board, which routes all the Qseven™ signals to standard interface connectors.
Gigabit Ethernet, 6x USB 2.0 + 1x USB Client
Support 2S1P up to 4S2P, parallel or
sequential battery operation
S3 support (Suspend to RAM)
MIC, Line In, Line Out, SPDIF
LEDs provide a direct view of charging and
battery capacity status
2x SATA
Input voltage of 19V DC
LPC POST code display, System speaker
Output 5V, 7A and 5V Standby
Power button, Reset button, LID button, Sleep button
Battery charging max. 17V, max. 3A
PCI Express switch, External BIOS flash
Size 70 mm x 60 mm
XTX / ETX
4x PCI Express x1, 1x ExpressCard, 1x Mini PCI Express Card,
1x SDIO Card Socket, 4x 32 Bit PCI
I²C EEPROM, Aux. signals for battery management
1x Dual Channel LVDS, 1x SDVO, HDMI or Display Port,
12 V single power input, ATX power input connector, CMOS battery
13
i
Tools
Backlight control
More Engineering Tools
on page 26ff.
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COM Express® - the concept
COM Express® is a PICMG standard that defines a Computer-On-Module, or COM, packaged as a super
component. The defined interfaces provide a smooth transition path from legacy interfaces to LVDS
(Low Voltage Differential Signaling) serial interfaces. This includes SDVO, PCI Express and Serial ATA.
Row C&D:
PCI Express Graphics
(PEG x16)
2x SDVO
(shared with PEG)
ExpressCard™
IDE
PCI 32 Bit
VCC
™
14
compact 95x95mm²
basic 125x95mm²
SDVO
extended 155x110mm²
LPC
(+12V primary, +5V standby,
3,3V RTC)
Row A&B:
6x PCI Express
4x SATA
8x USB
2x ExpressCard
1x Ethernet 100/1000
AC’97/HDA
Flatpanel (2x24Bit LVDS)
VGA
TVout
I²C
LPC
SMB
8x GPIO
D
C
B
A
congatec
Technology
Qseven
Size
PCI Express
PCI Express Graphic (PEG)
COM Express® defines 440 interconnect pins
between the COM Express® module and the
carrier board. Legacy buses such as PCI, parallel
ATA and LPC are supported along with new serial
high speed interfaces such as PCI Express, Serial
ATA and Gigabit Ethernet.
COM Express® modules are available in three
different sizes: Compact, Basic and Extended.
The primary difference between the modules is
the overall physical size and the performance
envelope supported by each.
The PEG interface utilizes up to 16 PCI Express
lanes in order to drive an external ultra high
performance graphic controller located on the
carrier board.
Legacy free
As with XTX™ and ETX®, the COM Express®
definition includes a heatspreader that acts as
a thermal interface between the COM Express®
module and the system‘s cooling solution. All
heat generating components are thermally
conducted to the heatspreader in order to avoid
hot spots.
In addition to the 32 bit parallel PCI bus, COM
Express® offers up to 22 PCI Express™ lanes. This
allows the customer to equip their embedded
PC application with the next generation of PC
performance. PCI Express™ is a low pin count
interface with maximum bandwidth per pin.
The scalable bandwidth is 2.5 GBit/s per lane
and direction.
COM Express® defines freely usable general
purpose inputs and outputs.
PICMG is a consortium of over 450 companies
who collaboratively develop open specifications
for high performance telecommunications and
industrial computing applications. The members
of the consortium have a long history of
developing leading edge products for these
industries.
XTX / ETX
GPIO
About PICMG
Tools
COM Express® is a legacy free standard. Outdated
interfaces such as floppy, PS/2 keyboard/mouse,
RS232, LPT are no longer supported. If required,
these legacy interfaces can be optionally
generated on the customized carrier board.
Thermal Design
COM Express
New interfaces
15
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COM Express® Basic - Product Overview
y
conga-BM57
Formfactor
CPU
DRAM
Chipsatz
Ethernet
I/O Interface
Serial ATA
PCI Express
PEG
USB
Intel® Core™ i7-620M
Intel® Core™ i5-520M
Intel® Celeron® P4500
preliminar
conga-BS57
Intel® Core™ i7-620LE
Intel® Core™ i7-620UE
Intel® Core™ i5-520E
max. 8 GByte DDR3 1066 MHz
max. 8 GByte DDR3 1333 MH
Intel® HM55
Intel® 82577LM Ethernet PHY,
conga-BM45
COM Express Basic, (95 x 125 mm),
Intel® Core™ 2 Duo SU9300,
Intel® Core™ 2 Duo P8400,
Intel® Core™ 2 Duo SP9300,
Intel® Celeron® 575,
Intel® Core™ 2 Duo SL9400,
Intel® Celeron® T3100
Intel® Celeron® M ULV 722,
Intel® Celeron® M ULV 723
max. 8 GByte DDR3 1067 MHz
Intel® GM45 / ICH9M-E,
Intel® GS45 / ICH9ME-SFF
Intel® GL40 / ICH9M-E
Intel® 82567LM Phy
Intel® Core™ 2 Duo T9400,
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
Mobile Intel® 5 Series HD Graphics
2x Display Port/HDMI
16
Realtek RTL8111
ü
ü
Temperature
Humidity
max. 2 GByte DDR2 533 MHz
Intel® 910GMLE / ICH6-M
ü
ü
-
-
3x
5x
Intel® Celeron® M 370
Intel® Celeron®M 373
Intel® Celeron® M 600
ü
ü
Power Consumption typ.
Type II connector layout
Intel® Core™ 2 Duo T7400,
Intel® Atom™ N270
Intel® Core™ 2 Duo L7400 LV,
Intel® Core™ 2 Duo U7500 ULV,
Intel® Core™ Duo L2400 LV,
Intel® Celeron® M440, M423
max. 4 GByte DDR2 667 MHz
Intel® 945GME / ICH7M-DH
conga-B915
3x
5x
ü
congatec Board controller
Embedded BIOS Feature
Security
Power Management
Operating Systems
conga-BA945
3x
5x
-
Express Card®
TV Out
conga-B945
3x
5x
-
EIDE
Sound
Graphics
Video Interface
conga-BS45
ü
Digital High Definition Audio Interface
Mobile Intel® Graphics Media Accelerator 4500MHD
LVDS 2x24 bit, analog VGA
1x Display Port / HDMI / SDVO
1x Display Port / SDVO
2x
5x
2x
5x
Intel® Graphics Media Accelerator 950
-
2x SDVO (shared with PEG port)
-
2x
3x
Intel® GMA 900
-
ü
ü
ü
ü
ü
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control
OEM Logo, OEM CMOS Defaults, LCD Control, Display Auto Detection, Backlight Control, Flash Update, Based on AMIBIOS8®
AMI Aptio® UEFI 2.x firmware, 4 MByte serial SPI firmware flash
Discrete on-board TPM 1.2/TCPA security functions, tor Hash, RSA, keys and random numbers (optional)
ACPI 3.0 with battery support
ACPI 2.0 with battery support
Microsoft® Windows XP, Microsoft® Windows® embedded Standard, Linux 2.6, QNX 6.x
Microsoft® Windows7
Microsoft® Windows CE 6.0
Processor TDP: 35 W
Processor TDP: 18 .. 35 W
Processor TDP: 25 .. 35 W
Processor TDP: 5.5 .. 25 W
Processor TDP: 5.5 .. 34 W
<10 W
Processor TDP: 5.5 .. 21 W
see manual for full details, CMOS Battery Backup
Operating: 0 .. +60°C
Storage: -20 .. +80°C
Operating: 10 - 90% r. H. non cond.
Storage: 5 - 95% r. H. non cond.
congatec
Technology
COM Express® Compact - Product Overview
USB
Express Card®
EIDE
Sound
Graphics
Video Interface
congatec Board controller
Embedded BIOS Feature
Security
Power Management
Operating Systems
Power Consumption typ.
COM Express Compact, (95 x 95 mm), Type II connector layout
Intel® Atom™ Z530
Intel® Atom™ Z510PT
Intel® Atom™ Z510
Intel® Atom™ Z520PT
Intel® Atom™ N270
max 2 GByte DDR2 533 MHz
max. 1 GByte DDR2 533 MHz
Intel® 945GSE / ICH7-M
Intel® System Controller Hub US15W
Intel® System Controller Hub US15WPT
Realtek RTL8111
Intel® 82574L
3x
2x
2x
-
5x
3x
-
up to 2x
-
up to 2x
-





-
-






Digital High Definition Audio Interface
Intel® GMA 950
Intel® GMA 500
Mobile Intel® GMA 4500MHD
LVDS 2x24 bit, VGA
LVDS 2x18 bit, VGA
LVDS 1x24 bit
1x Display Port / HDMI / SDVO
1x SDVO
1x Display Port / SDVO
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup Data Backup,
I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control
OEM Logo, OEM CMOS Defaults, LCD Control, Display Auto Detection, Backlight Control, Flash Update, Based on AMIBIOS8®
TPM 1.2/TCPA security functions, tor Hash, RSA, keys and random numbers (optional)
ACPI 3.0 with battery support
Microsoft® Windows7
Microsoft® Windows CE 6.0
Microsoft® Windows XP, Microsoft® Windows® embedded Standard, Linux 2.6, QNX 6.x
Processor TDP: 5 .. 25 W
<10 W
<5 W
<5 W
see manual for full details, CMOS Battery Backup
Operating: 0 .. +60°C
Storage: -20 .. +80°C
Operating: -40 to 80°C; Storage: -40 to 80°C
Operating: 10 - 90% r. H. non cond.
Storage: 5 - 95% r. H. non cond.
Tools
Temperature
Humidity
conga-CAx
Qseven
DRAM
Chipsatz
Ethernet
I/O Interface
Serial ATA
PCI Express
PEG
Intel® Core™ 2 Duo SU9300,
Intel® Core™ 2 Duo SP9300,
Intel® Core™ 2 Duo SL9400,
Intel® Celeron® M ULV 722, ULV 723
max. 4 GByte DDR3 1067 MHz
Intel® GS45 / ICH9ME-SFF
Intel® 82567LM Phy
conga-CA
XTX / ETX
Formfactor
CPU
conga-CA945
COM Express
conga-CS45
17
w w w.congatec.com
COM Express® - Engineering Tools
conga-CEVAL
conga-CKIT
Evaluation Carrier Board for COM Express® modules. To achieve a quick start with COM
This complete kit provides the ability to start evaluating
Express® congatec offers an evaluation carrier board, which routes all the COM Express®
COM Express™ modules immediately.
signals to standard interface connectors. Supports COM Express® Compact and Basic
Contents:
modules using connector Pinout Type 2.
conga-CEVAL evaluation carrier board
4x1 PCI Express, 1xExpress Card, 1x 16 PCI Express
Graphics (PEG), 1x Mini PCI Express Card, 4x 32 PCI
Gigabit Ethernet
8x USB
AC97 compatible codec
HDA optional via connector
4x SATA, 1x PATA
4x COM, 1x LPT, 1x Floppy, PS2 kbd./mouse
PCI display
System speaker, Power button, Reset button, CMOS Battery
CRT connector, LVDS interface
ATX connector,12V/GND banana jacks
18
conga-Cdebug Post-Code and debug card with cables
conga-FPA1 flat panel adapter with cables
HDA (High Definition Audio) adapter card
Dual DVI-D ADD2 card
ATX power supply with cables
DVD drive
USB Memory Stick
Cable set for IDE, SATA
congatec software tools & Quick Installation Guide
for download on our website:
www.congatec.com / ckit.html
congatec
conga - SBM 2 C- Kit
SMART Battery Manager Module
conga-Cdebug
This battery manager kit can be operated in conjunction
conga - SBM²C is a complete battery manager sub system
COM Express® Debug Platform. The conga-Cdebug provides a
with the congatec COM Express starter kit. When used
implemented as a plug in module. This COM Express version
debug platform for your application specific carrier board. Simply
together they provide a fast and simple way of evaluation
supports 12V power line.
use it as a transparent debug interface between your carrier board
and the COM Express® module.
all the features and configurations offered by the COM
Express and conga-SBM C modules. Contents:
®
2
Supports battery configurations 2S1P up to 4S3P
Parallel battery operation (sequential on request)
SMART Battery Manager Module conga-SBM C
2
SMART Battery
Complete set of cables required for testing in conjunction
with the conga-CEVAL evaluation carrier board
conga-ADD2DP
S3 support (Suspend to RAM)
LEDs provide a direct view of charging and battery
capacity status
19
2x SATA connector
Power connector for carrier board independent operation
VGA
Output 12V / ~70W and 5V / ~30W, 5V Standby ~1W
2x USB
Battery charging max. 17 V, max. 3A total
Power and reset switch
Size 68 mm x 110 mm x 12.5 mm
LED`s:
• 4x GPIO status
• 4x Command Byte Enable (CBE=PCI bus activity)
Size 95 x 95 mm
The conga - ADD2DP provides two DisplayPort
the conga -CEVAL and the conga-BM45.
LPC Firmware Hub Flash (FWH)
Input voltage of 19V DC, with input power delimitation
Add2 Card for DisplayPort
and two HDMI interfaces when used in conjunction with
Postcode display for LPC or PCI
XTX / ETX
®
i
Tools
®
COM Express
Qseven
Technology
COM Express® - Engineering Tools
More Engineering Tools
on page 26ff.
w w w.congatec.com
XTX™ - the concept
XTX™ is an expansion and continuation of the well established and highly
successful ETX® standard. XTX™ offers the newest I/O technologies on this
proven form factor. Now that the ISA bus is being used less and less in
modern embedded applications, congatec offers different features on the
X2 connector instead of the ISA bus currently found on the ETX® platform PCI
Express guarantees longvity for XTX™.
ETX®
Pinout X2 - XTX™ <-> ETX®
X2
ETX™
It was defined in 1998 by JUMPtec as an open standard. ETX® is
a well established and highly successful standard. It offers most
standard PC I/O’s on a compact form factor.
X4
EIDE 1+2
Ethernet
SM Bus
I²C Bus 400 kHz
Speaker
Power Control
Power Management
X3
VGA
TV-Out
LCD (LVDS or TTL)
COM1+2
IrDA
LPT/Floppy (shared)
ISA - Bus
X2
X2
PCI Bus
4x USB 2.0
Mic In (Mono)
Line In (Stereo)
Line Out (Stereo)
20
ETX® was one of the very first Computer-On-Module concepts ever.
4x PCI Express
4x Serial ATA
2x USB 2.0
(2x ExpressCard)
High Definition Audio
LPC Bus
Ext. System Management
Fan Control
X1
X2
congatec
Technology
Qseven
ExpressCard™
Backwards Compatible to ETX®
Upgrade to XTX™
In addition to the 32 bit parallel PCI bus,
XTX™ offers 4 PCI Express™ lanes. This allows
the customer to equip their embedded
PC application with next generation of PC
performance. PCI Express™ is a low pin count
interface with maximum bandwidth per pin. The
scalable bandwidth is 2.5 GBit/s per lane and
direction.
XTX™ supports up to two ExpressCard™ slots.
ExpressCard™ is the successor to PCMCIA.
XTX™ is 100% backwards compatible to the
ETX® standard. Most customer specific carrier
boards will not require a redesign in order to use
congatec’s XTX™ modules. The ISA bus can be
implemented through the use of a PCI-ISA bridge
on the customer specific carrier board. As an
alternative to this the customer can use the readily
available XTX™ LPC bus.
Applications which do not utilize the ISA bus can
directly upgrade to XTX modules. The signals at
connectors X1, X3 and X4 are equal to ETX®.
Only the signals at the X2 connector have been
redefined in order to support PCI Express, SATA,
LPC and more. Existing ETX® carrier boards can
easily be upgraded to take advantage of these
new and fast interfaces.
Serial ATA Interfaces (SATA)
As a replacement to the no longer supported ISA
bus, XTX™ offers the LPC (Low Pin Count) bus. The
LPC bus corresponds approximately to a serialized
ISA bus yet with a significantly reduced number of
signals.
21
XTX™ offers two additional USB 2.0 ports thereby
increasing the total amount of USB ports
available to 6.
LPC Bus
Identical Mechanics to ETX®
The size (95x114 mm), the mounting, the height,
the connectors and the heatspreader are exactly
the same as defined in the ETX® specification.
Existing ETX® solutions can easily switch to the
innovative XTX™ platform without any mechanical
change.
Tools
SATA is an enhancement of the parallel ATA
there-fore offering higher performance. As a
result of this enhancement the traditional
restrictions of parallel ATA are overcome with
respect to speed and EMI.
High Speed USB
COM Express
PCI Express
XTX / ETX
Advantages XTX™
w w w.congatec.com
XTX™ - Product Overview
conga-X965
Formfactor
CPU
DRAM
Chipsatz
Ethernet
I/O Interface
Serial ATA
PCI Express
USB
-Express Card®
EIDE
Sound
Graphics
Video Interface
TV Out
congatec Board controller
Embedded BIOS Feature
Security
Power Management
Operating Systems
Power Consumption typ.
Temperature
Humidity
22
Intel® Core™ 2 Duo U7500,
Intel® Core™ 2 Duo L7500,
Intel® Celeron® M 550
Intel® GME965 / ICH8-M
3x
4x
6x
2x
1x
Intel® Graphics Media Accelerator X3100
conga-X945
conga-XA945
conga-X915
ETX® Spec 2.7. without ISA Support, XTX™ Extensions, 95 x 114 mm (3.7“ x 4.5“)
Intel® Core™ 2 Duo L7400 LV,
Intel® Atom™ N270 1.6 GHz
Intel® Pentium® M 745,
Intel® Core™ 2 Duo U7500 ULV,
Intel® Pentium® M 738,
Intel® Core™ Duo L2400 LV,
Intel® Celeron® M 373,
Intel® Celeron® M440, M423
Intel® Celeron® M
max. 2GByte DDR2 667 MHz
max. 2GByte DDR2 400 MHz
Intel® 945GME / ICH7-M
Intel® 915GME / ICH6-M
IEEE 802.3u 100Base-Tx, Fast Ethernet compatible
2x
4x
6x
2x
1x
2x
2x
3x
4x
6x
6x
2x
2x
1x
1x
Digital High Definition Audio Interface with support for multiple audio codecs
Intel® Graphics Media Accelerator 950
Intel® Graphics Media Accelerator 900
VGA
LVDS 2x 24 bit
2x SDVO
ü
conga-XLX
AMD Geode™ LX 800
max. 1GByte DDR333
AMD Geode™ CS5536
2x
4x
2x
Integrated in chipset
LVDS 1x 24 bit
-
ü
ü
ü
Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup Data Backup, I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control
OEM Logo, OEM CMOS Defaults, LCD Control, (Auto Detection, Backlight Control), Flash Update
Based on Insyde XpressROM
Serial Port Console Redirection, for Remote Setup and Installation, Based on AMIBIOS8®
TPM 1.2/TCPA Security Functions, tor Hash, RSA, Keys and Random Numbers (optional)
ACPI 2.0 with Battery support
Microsoft® Windows7
Microsoft® Windows XP, Microsoft® Windows® embedded Standard, Microsoft® Windows CE 6.0, Linux 2.6, QNX 6.x
Processor TDP: 10 .. 31 W
Processor TDP: 5.5 .. 27 W
Typ. application: <10 W
Processor TDP: 5.5 .. 21 W
< 5W
see manual for full details, CMOS Battery Backup
Operating: 0 .. +60°C
Storage: -20 .. +80°C
Operating: 10 - 90% r. H. non cond.
Storage: 5 - 95% r. H. non cond.
evaluating XTX™ modules immediately. Contents:
congatec
conga-XDVI
Evaluation Board for XTX™ modules. To achieve a
XTX™ Debug Platform. The conga-Xdebug provides
Evaluation Platform to convert SDVO
quick start with XTX™ congatec offers an evaluation
a debug platform for your application specific
to DVI-D. The conga-XDVI provides the
carrier board, which routes all the XTX™ signals to
carrier board. Simply use it as a transparent debug
ability to evaluate the SDVO features
standard interface connectors. With this you`re
interface between your carrier board and the XTX™
found on most of congatec`s XTX™
able to check out all of the innovative XTX™
module.
modules. It`s fully supported by the
features and your specific expansions immediately.
congatec Embedded BIOS.
conga-XEVAL evaluation carrier board
2x PCI Express
Postcode Display for LPC or PCI
LPC Firmware Hub Flash (FWH)
conga-Xdebug Post-Code and debug card
2x Express Card Socket
conga-FPA1 flat panel adapter with cables
4x 32 Bit PCI
ATX power supply with cables
1x LPT, 2x COM, 1x PS/2 Keyboard and Mouse
CD-ROM drive
10/100 Ethernet
USB Memory Stick
6x USB (2 routed to Express Card Sockets)
conga-XDVI DVI evaluation platform
IrDA connector
Cable set for IDE, SATA, Floppy Drives
COM3+4 via carrier board Super I/O
congatec software tools & Quick Installation Guide
for download on our website:
www. congatec.com/ xkit.html
LPT2 via carrier board super I/O
LED`s
• 4x GPIO Status
• 4x Command Byte Enable (CBE) for PCI Bus
activity
4x SATA, 2x IDE (master/slave)
Size: 95 x 114 mm
SDVO to 2x DVI-D
• 2x Chrontel CH7307C
1x SATA Connector
COM Express
This complete kit provides the ability to start
conga-Xdebug
Power connector for carrier board independant
operation
VGA / Keyboard / Mouse / COM / USB
XTX / ETX
conga-XKIT
conga-XEVAL
Qseven
Technology
XTX™ - Engineering Tools
Power and Reset Buttons
Tools
Audio: Additional AC`97 Audio Codec, SPDIF optical, Line in/Out (stereo), Mic in (mono)
23
w w w.congatec.com
XTX™ - Engineering Tools
Mini-ITX Carrier Board
for XTX™
The conga-ITX/X is a full featured carrier
board for XTX™ and is the size of a Mini-ITX board.
Formfactor
Mini-ITX
Supported Modules
All XTX™ Embedded Computer Modules
Expansion Slots
1x PCI with ATX Riser extension, 1x PCI Express x1, 1x miniPCI Express
Ethernet
1x Gigabit Ethernet 10/100/1000 BaseT, 1x 10/100 BaseT
1x SATA, 1x EIDE, 1x CompactFlash Socket
SMART Battery Manager
Module
conga-SBM -Kit
This battery manager kit can be operated in
Mass Storage
Interface
conga-SBM2 is a complete battery manager
conjunction with the congatec XTX™ starter
I/O
4x USB at the front panel, 1x USB pin header
4x COM (1x front panel, 2x RS232 10 pin header, 1x TTL)
1x LPT, PS/2 Keyboard and Mouse, on board system speaker
and configurations offered by the XTX™ and
Sound
Line In, Line Out, Mic In at front panel
SBM2 modules. Contents:
Video
Analog VGA on front panel
LVDS interface (EPI - Embedded Panel Interface) 34 pin 2 mm header
Backlight connector, 10 pin 2.54 mm header
CMOS battery
on board lithium battery for CMOS backup and real time clock
Battery Support
all signals for ACPI battery support (conga-SBM²) at
the feature connector
Power
ATX standard power connector
Output 5V, 7A and 12V, 2A
Fan
3 pin header, 12 V and tacho signal
Battery charging max. 17V, max. 3A
Temperature
Operating: 0 .. +60°C, Storage: -20 .. +80°C
Humidity
Operating: 10 - 90% r. H. non cond., Storage: 5 - 95% r. H. non cond.
Size
170 x 170 mm (6.7" x 6.7")
sub-system in the form of a plug-in module.
Support 2S1P up to 4S3P, parallel or sequential battery operation
S3 support (Suspend to RAM)
2
kit. When used together they provide a fast and
simple way of evaluating all the functionalities
SMART Battery Manager Module conga-SBM2
LEDs provide a direct view of charging and battery
capacity status
SMART Battery
Input voltage of 19V DC, max. 4.5A with input power
delimitation
Complete set of cables required for testing in
conjunction with the conga-XEVAL evaluation
carrier board
Size 68 mm x 95 mm x 12.5 mm
24
i
More Engineering Tools
on page 26ff.
congatec
Technology
ETX® - Product Overview
1x (UDMA-66/100)
ü
1x (UDMA-33)
-
USB
ü
ü
Compact Flash®
ü
ü
PCI Bus
Sound
Graphics
Video Interface
TV Out
congatec Board controller
Embedded BIOS Feature
Power Management
Operating Systems
Power Consumption typ.
Temperature
Humidity
ü
ü
AC‘97 Rev.2.2 compatible, Line In, Line Out, Mic In
Integrated in chipset up to 254 MByte graphic memory (UMA)
LVDS 1x24 bit, VGA
ü
Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and
Board information, Board Statistics BIOS Setup Data Backup,
I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control
OEM Logo, OEM CMOS Defaults, LCD Control (Auto Detection, Backlight Control),
Flash Update, Based on Insyde XpressROM
APM 1.2
Microsoft® Windows XP, Microsoft® Windows® embedded Standard,
Microsoft® Windows CE 6.0, Linux 2.6, QNX 6.x
<5 W
<5 W
see manual for full details, CMOS Battery Backup
Operating: 0 .. +60°C
Storage: -20 .. +80°C
Operating: 10 - 90% r. H. non cond.
Storage: 5 - 95% r. H. non cond.
Evaluation Board for ETX® modules. To achieve a quick start with ETX® congatec offers
an evaluation carrier board, which routes all the ETX® signals to standard interface
connectors. With this you‘re able to check out all of the ETX® features and your specific
expansions immediately.
ISA Bus 3 Slots, PCI Bus 4 Slots
1x LPT, 2x COM
1x PS/2 Keyboard & Mouse
10/100 Ethernet
LVDS, TVout
CompactFlash
4x USB
2x IDE (master/slave)
Audio
• Line In/Out (stereo)
• Mic In (mono)
i
25
Qseven
conga-EVAL
COM Express
ETX® Spec 2.7, 95 x 114 mm (3.7“ x 4.5“)
AMD Geode™ LX 800
up to 1 Gbyte DDR333
Onboard 256 GB
AMD Geode™ CS5536
IEEE 802.3u 100Base-Tx, Fast Ethernet compatible
XTX / ETX
Formfactor
CPU
DRAM
Chipsatz
Ethernet
I/O Interface
EIDE
IDE
conga-ELXeco
Tools
conga-ELX
More Engineering Tools
on page 26ff.
w w w.congatec.com
Engineering Tools for Qseven™, COM Express®,
Cooling Solution
Heatspreader
The specifications for Qseven™, COM Express®, XTX™ and ETX®
embedded computer modules include a heatspreader, which
is a mechanical definition of the thermal interface. All the heat
generated by components such as chipsets and processors is
transferred to the system’s cooling via the heatspreader. This can
be achieved by either a thermal connection to the casing, a
heat pipe or a heat sink.
Active cooling solution
Thermal simulation
of an active cooling solution
Passive cooling solution
Thermal Stacks
Active and passive standard cooling solutions
Compared with sandwich-type constructions for heatspreaders and
coo-ling systems, active and passive cooling solutions remove one layer
from the process. The heatspreader and cooler are manufactured as one
unit, which enables them to provide faster thermal conduction. For an
active cooling solution, a high performance quiet fan has been integrated
within the cooling fins.
26
The “thermal stacks” can also be used separately
without a heatspreader. It is distinguished from a
heatspreader by its lack of a thermal conductive
surface. This also reduces differences in
temperature.
congatec
conga-FPA2
conga-LDVI
conga-FPA2 is a universal flat panel adapter board that has been designed to be EPI (Embed-
DVI Converter Module for LVDS
ded Panel Interface) compliant. It can be used for either prototyping, demonstration purposes,
or for debugging certain issues. It may also serve as a reference for the implementation of
panel adaptations on customer specific carrier boards.
Compact module to convert LVDS to DVI-D. It can be used with either COM Express®, Qseven™
or XTX™ modules. It`s now possible to realize a dual port DVI-D system independent of the
typical Video Output Ports (SDVO or DVO).
Multiple I/O Combinations
• LVDS to TTL
COM Express
Qseven
Technology
XTX™ and ETX®
18 and 24 Bit single-pixel support
Power Management
All typ. supply voltages selectable
Fully s/w controlled power sequencing
Backlight Connector: Supports most backlight converters
Software controlled brightness adjustment
27
i
More Engineering Tools for
Qseven™ on page 11ff.
ComExpress® on page 18ff.
XTX™ on page 23ff.
ETX® on page 25
w w w.congatec.com
Tools
XTX / ETX
Configuration Memory
EPI compliant EEPROM for custom panel settings
Via Solferino 12
Contradata Milano S.r.l.
20052 Monza (MB) Italy
Tel. (+39) 039.2301492
Fax (+39) 039.2301489
[email protected]
www.contradata.it
© 2010 congatec AG. All rights reserved.
conga, congatec and XTX™ are registered trademarks of congatec AG. Intel, Pentium and
Intel Atom are trademarks of Intel Corporation in the U.S. and other countries. COM Express
is a registered trademark of PICMG. Express Card is a registered trademark of the Personnel
Computer Memory Card international Association (PCMCIA). PCI express is a registered
trademark of the Peripheral Component Interconnect Special Interest Group (PCISIG).
CompactFlash is a registered trademark of the Compact Flash Association. Winbond is a
registered trademark of the Winbond Electronics corps. AVR is a registered trademark of
the Atmel corporation. ETX is a registered trademark of Kontron Embedded Modules GmbH.
AMICORE8 is a registered trademark of American Megatrends inc. Microsoft®, Windows®,
Windows NT®, Windows CE and Windows XP® are registered trademarks of Microsoft corporation. VxWorks is a registered trademark of WindRiver. All product names and logos are
property of the respective manufacturers.
All data is for information purposes only. Although all the information contained within this
document is carefully checked no guarantee of correctness is implied or expressed.
Vendite e supporto tecnico Italia
Headquarter:
Subsidiaries:
congatec AG
congatec AG Asia Pacific
congatec, Inc.
congatec s.r.o.
Auwiesenstraße 5
94469 Deggendorf,
Germany
12F-5, No. 270, Sec 4,
Zhongxiao E. Rd.
106 Taipei City, Taiwan
6262 Ferris Square
San Diego
CA 92121 USA
Brojova 16
PSČ 326 00 Plzeň
Czech Republic
Phone +49 (991) 2700-0
Fax
+49 (991) 2700 -111
Phone +886 2 2775 4645
Fax
+886 2 2775 3263
Phone +1 858-457-2600
Fax
+1 858-457-2602
[email protected]
www.congatec.de
[email protected]
www.congatec.tw
[email protected]
www.congatec.us
w w w.con ga t e c . com
Contradata is a distributor of embedded
computer technology and covers the entire
Italian territory. The local sales staff is fully
capable of helping customers to define
their products and configurations. Support
is supplied by a strong engineering team
whose solid technical background can
provide essential assistance to its custo
mers. They're not only limited to hardware
solutions but can also provide software
assistance when dealing with todays most
common operating systems i.e. WinCE,
WinXPE and Linux.